NEWS

How Low-Dielectric-Loss Materials Empower Green Data Centers and Efficient RF Applications


Release time:

2025-10-21

High-frequency, high-speed hydrocarbon resins exemplify low-dielectric-loss materials, offering an ideal solution to break this cycle. Their core advantage lies in molecular-level high purity.

Against the backdrop of global efforts toward carbon neutrality and sustainable development, energy consumption in the electronics and information industry has drawn increasing attention. Data centers, serving as the “heart” of the digital economy, present a pressing challenge due to their staggering power consumption. Among numerous energy-saving technologies, one often overlooked yet critical approach involves leveraging low dielectric loss materials at the material level to build more efficient hardware systems, thereby reducing energy loss at the source of signal transmission.

Dielectric loss, simply put, refers to the phenomenon where electromagnetic waves propagating through dielectric materials convert part of their electrical energy into heat, resulting in energy loss. On the PCBs of high-speed servers and switches, each digital signal pulse transmission incurs energy loss due to dielectric loss in the substrate material. At transmission rates reaching hundreds of Gbps, these minute losses accumulate. Not only do they degrade signal quality, necessitating increased power consumption for signal compensation and error correction, but they also generate substantial waste heat. This further burdens data center cooling systems, creating a vicious cycle of energy consumption.

High-frequency, high-speed hydrocarbon resins, exemplifying low-dielectric-loss materials, offer an ideal solution to break this cycle. Their core advantage lies in molecular-level purity. Through advanced synthesis and purification techniques, these materials contain virtually no polar groups capable of inducing dipole rotation loss under high-frequency electromagnetic fields. This results in a dielectric loss factor (Df) far lower than traditional materials, minimizing energy loss during signal transmission. Consequently, it directly reduces the power consumption of signal-driving and processing chips.

The application scenarios for this advantage extend far beyond data centers. In the RF power amplifiers (PAs) of 5G base stations, amplifier efficiency is a critical metric for performance and operational cost evaluation. Using low-dielectric-loss materials as substrates for PA circuits significantly reduces RF energy dissipation within the circuitry. This allows more electrical energy to be efficiently converted into transmitted wireless signals rather than wasted as heat. This not only translates to higher PA efficiency and lower power costs but also simplifies thermal management design, enabling smaller and lighter base stations.

Furthermore, the application of low dielectric loss materials holds significant importance in high-end consumer electronics, such as Wi-Fi 7 routers and smartphone RF front-end modules. It enhances device connectivity and battery life, enabling signals to travel farther and more stably while reducing performance degradation and poor user experiences caused by heat generation.
In summary, the promotion and application of low-dielectric-loss materials represent a profound “foundational energy-saving revolution.” Materials like high-frequency, high-speed hydrocarbon resins achieve energy savings by reducing signal transmission losses at the physical level, thereby minimizing inefficient energy dissipation. This provides a robust material foundation for building green, efficient, and sustainable digital infrastructure. Their strategic importance is particularly critical in today's era of increasingly constrained energy resources.

NEWS

Key Materials for the 5G Era: Why High-Frequency, High-Speed Hydrocarbon Resins Have Become the “New Favorite” in the CCL Industry?

With the widespread adoption of 5G communication technology and the initiation of preliminary research on 6G, the electronics information industry has reached an unprecedented level of demand for signal transmission rates and quality. Against this backdrop, clad copper laminates (CCL)—the core substrate material for printed circuit boards (PCBs)—are undergoing a revolution in materials science. Among the many high-frequency, high-speed substrate solutions available, high-frequency, high-speed hydrocarbon resins, thanks to their outstanding dielectric properties, are gradually replacing traditional materials and emerging as a key raw material in the field of advanced electronic circuits.

2025-12-02

Re-evaluating RF Circuit Material Costs: The Comprehensive Value of Hydrocarbon Resins

When developing new RF circuit products, cost control is a critical reality engineers and project managers must confront.

2025-10-21

The Lifeline of Mass Production: How Carbon-Hydrogen Resins Ensure Dielectric Property Consistency at the Molecular Level

The exceptional dielectric consistency exhibited by high-performance, high-frequency, high-speed hydrocarbon resins stems precisely from elevating quality control from traditional “finished product inspection” to “full-process prevention and management.”

2025-10-21

Key Process Considerations for High-Frequency, High-Speed Hydrocarbon Resin PCB Manufacturing

Although high-frequency, high-speed hydrocarbon resins offer excellent process adaptability, achieving optimal results still requires particular attention to critical steps such as lamination and drilling. A deep understanding and mastery of these fundamental processes are key to ensuring high yield and high-performance production.

2025-10-21

Core Requirements for 5G Antenna Substrate Materials and the Value of Hydrocarbon Resins

High-frequency, high-speed hydrocarbon resins have become the ideal choice for 5G antenna substrates due to their outstanding performance in these fields. Their core advantages lie in their exceptional “purity” and “stability.”

2025-10-21

High-Frequency Material Selection Comparison: Hydrocarbon Resin vs. Traditional Materials—A Deep Dive

The advent of high-frequency, high-speed hydrocarbon resins precisely fills the significant market gap between PTFE and FR-4. As a thermosetting resin, it achieves ultra-low dielectric loss comparable to PTFE through precise molecular engineering and deep hydrogenation processes.

2025-10-21