NEWS
With the widespread adoption of 5G communication technology and the initiation of preliminary research on 6G, the electronics information industry has reached an unprecedented level of demand for signal transmission rates and quality. Against this backdrop, clad copper laminates (CCL)—the core substrate material for printed circuit boards (PCBs)—are undergoing a revolution in materials science. Among the many high-frequency, high-speed substrate solutions available, high-frequency, high-speed hydrocarbon resins, thanks to their outstanding dielectric properties, are gradually replacing traditional materials and emerging as a key raw material in the field of advanced electronic circuits.
02
2025
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12
Re-evaluating RF Circuit Material Costs: The Comprehensive Value of Hydrocarbon Resins
When developing new RF circuit products, cost control is a critical reality engineers and project managers must confront.
21
2025
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10
The exceptional dielectric consistency exhibited by high-performance, high-frequency, high-speed hydrocarbon resins stems precisely from elevating quality control from traditional “finished product inspection” to “full-process prevention and management.”
21
2025
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10
Key Process Considerations for High-Frequency, High-Speed Hydrocarbon Resin PCB Manufacturing
Although high-frequency, high-speed hydrocarbon resins offer excellent process adaptability, achieving optimal results still requires particular attention to critical steps such as lamination and drilling. A deep understanding and mastery of these fundamental processes are key to ensuring high yield and high-performance production.
21
2025
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10
Core Requirements for 5G Antenna Substrate Materials and the Value of Hydrocarbon Resins
High-frequency, high-speed hydrocarbon resins have become the ideal choice for 5G antenna substrates due to their outstanding performance in these fields. Their core advantages lie in their exceptional “purity” and “stability.”
21
2025
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10
The advent of high-frequency, high-speed hydrocarbon resins precisely fills the significant market gap between PTFE and FR-4. As a thermosetting resin, it achieves ultra-low dielectric loss comparable to PTFE through precise molecular engineering and deep hydrogenation processes.
21
2025
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10