A new generation of hydrocarbon resins boosts the performance of high-frequency, high-speed copper-clad laminates.

As global information and communication technologies steadily advance from 5G to 6G, mobile networks are rapidly evolving toward ultra-high bandwidth, ultra-low latency, and full-spatial coverage. Against this technological backdrop, signal transmission frequencies have expanded from centimeter waves to millimeter waves and are even beginning to leap into the terahertz (THz) band. This dramatic frequency shift places extraordinarily stringent physical-performance requirements on the signal carriers—printed circuit boards (PCBs) and their core material, copper-clad laminates (CCLs). In this field, Hydrocarbon resin With its unique molecular structure and outstanding electrical performance, it is emerging as a key material of the new generation, serving as an important cornerstone for ushering in the era of 6G and high-performance computing (HPC).
I. Definition and Material Background of Hydrocarbon Resins
Hydrocarbon resins typically refer to polymer systems composed of two elements—carbon and hydrogen. Typical examples include polybutadiene, styrene-butadiene copolymers, and their modified derivatives. Unlike conventional epoxy resins, hydrocarbon resins contain very few polar functional groups in their molecular structure, giving them an inherent advantage when dealing with high-frequency electromagnetic waves. In the development of next-generation high-frequency, high-speed copper-clad laminates, hydrocarbon resins can be used not only as the primary resin but also as modifiers to optimize the dielectric properties of the resin system.
II. Analysis of the Core Advantages of the New Generation Hydrocarbon Resin
That's why it's said Hydrocarbon resin It’s the “ideal choice” for the 6G era, primarily because it breaks through the physical limits of traditional materials in multiple dimensions. Its specific advantages are reflected in the following aspects:
1. Ultra-low dielectric performance: the “highway” for signal transmission
In high-frequency communications, the dielectric constant (Dk) determines the speed of signal transmission, while the dissipation factor (Df) dictates the degree of signal energy attenuation. Thanks to their highly symmetrical, nonpolar molecular structure, next-generation hydrocarbon resins typically have Df values that can be kept below 0.002—approaching even the levels seen in PTFE (polytetrafluoroethylene). Compared to conventional epoxy resins, hydrocarbon resins can significantly reduce thermal energy loss during signal transmission, thereby ensuring signal integrity in the terahertz frequency band. This is precisely the technological prerequisite for achieving ultra-high-speed 6G data transmission.
2. Exceptional moisture and heat resistance and stability: Unafraid of harsh environments.
Electronic components, during operation, are inevitably affected by ambient humidity. Water has an extremely high dielectric constant (Dk ≈ 80), which can easily compromise the signal integrity of high-frequency circuits. Hydrocarbon resins, due to the absence of hydrophilic groups in their molecular chains, exhibit very low water absorption rates. This means that even in humid environments, printed circuit boards fabricated using hydrocarbon resins can still maintain stable electrical performance. Moreover, the new generation of hydrocarbon resins, through molecular modification, has significantly increased their glass transition temperature (Tg), enabling them to demonstrate outstanding dimensional stability under high-temperature soldering and prolonged operational conditions.

3. Excellent processing compatibility: Balancing performance and efficiency.
Although PTFE also boasts excellent electrical performance, its processing difficulties, poor adhesion to copper foil, and high cost have limited its application in large-scale civilian fields. In contrast, the new generation... Hydrocarbon resin It exhibits superior processability. It can be crosslinked and cured via free-radical initiation, making it not only compatible with existing conventional PCB manufacturing processes but also capable of achieving excellent adhesion to copper foil through formulation adjustments. This balanced combination of “high performance” and “easy processability” makes it the preferred solution for large-scale commercial applications.
4. Excellent copper foil compatibility and reliability
In high-speed transmission, the skin effect causes electrical signals to propagate only on the surface of copper foil; therefore, it is necessary to use very-low-profile (VLP) or ultra-low-profile (HVLP) copper foils. Thanks to their exceptional wettability, hydrocarbon resin systems can form strong physical and chemical bonds with these smooth copper foil surfaces. This outstanding adhesion not only enhances the board’s peel strength but also improves its reliability under repeated thermal cycling, effectively preventing interlayer cracking or delamination.
III. Strengthening the Strategic Position of 6G and AI Computing Power
As we enter the 6G era, base station equipment will become increasingly dense, and antenna arrays will evolve into ultra-large-scale configurations. The application of hydrocarbon resins in this field is not limited to base station antennas; rather, it extends deeply into the following core scenarios:
• Low-Earth-Orbit Satellite Communications: Satellite internet places extremely high demands on the radiation resistance and dielectric stability of materials under extreme temperature variations; hydrocarbon resins are ideal aerospace-grade materials.
• AI Servers and Data Centers: With the explosive growth of large-scale AI models, the data exchange speed among computing chips has been increasing exponentially. High-speed copper-clad boards enabled by hydrocarbon resins are crucial for interconnecting high-bandwidth memory (HBM) with GPUs.
• Intelligent driving radar: Millimeter-wave radars operating at 77 GHz and higher frequencies require dielectric materials with extremely low loss to enhance detection accuracy, and hydrocarbon resins play an irreplaceable role in this regard.
IV. Conclusion and Future Outlook
New generation Hydrocarbon resin Its development marks China's advance into uncharted territory in the field of high-end electronic materials. Not only does it address the industry’s longstanding pain point of signal loss in high-frequency circuits, but it also provides a material foundation for green communications and efficient computing power. As synthesis technologies continue to improve, future hydrocarbon resins will evolve toward lower costs, higher strength, and more environmentally friendly bio-based solutions.
On the journey toward the 6G era, hydrocarbon resins are undoubtedly the unsung heroes quietly underpinning the interconnectedness of all things and seamless communication across every spatial domain. Through continuous technological innovation, hydrocarbon resins will continue to drive a leap forward in the performance of copper-clad laminates, opening a new chapter in the history of human communications. For companies along the upstream and downstream segments of the industrial chain, deepening expertise in hydrocarbon resins and their application technologies is not only a necessity for technological advancement but also a strategic opportunity to secure a leading position in the electronics information industry over the next decade.

Disai New Materials We are pioneers and practitioners in the development of new materials and technologies for high-end electronic circuit substrates. Our main products include hydrocarbon resins, high-frequency and high-speed hydrocarbon resins, and low-dielectric hydrocarbon resins. Please feel free to call us at 027-81801908 or 13971395740 (same number on WeChat). We’ll provide you with customized, professional services!