Application Practice of Disai New Materials’ High-Frequency, High-Speed Hydrocarbon Resin in the Millimeter-Wave Radar Field

With the rapid advancement of intelligent driving, 5G-A (5.5G), and future 6G communication technologies, the electronic circuits industry is facing an unprecedented materials revolution. In this wave of technological innovation, millimeter-wave radar—acting as the “eyes” of autonomous vehicles—has its core substrate performance directly determining the accuracy and detection range of its sensing capabilities. For a long time, the high-end, high-frequency substrate market has been monopolized by overseas giants. However, as domestic supply chains increasingly demand autonomy and controllability, local enterprises—represented by Disai New Materials—are achieving a critical breakthrough from “catching up” to “running alongside” through their independently developed high-frequency, high-speed hydrocarbon resin systems.
I. Industry Pain Points: Why Are Traditional Resins Struggling to Meet the Demands of Millimeter-Wave Radar?
Millimeter-wave radars typically operate at frequencies ranging from 24 GHz to 77 GHz—or even higher. According to the principles of physics, the higher the signal frequency, the greater the transmission loss in the medium through which the signal travels.
Although traditional epoxy resins boast mature processing techniques and low costs, their relatively high dielectric constant (Dk) and dissipation factor (Df) can lead to significant high-frequency signal attenuation, as well as signal delay and distortion. On the other hand, polytetrafluoroethylene (PTFE), despite its excellent electrical performance, suffers from processing difficulties—such as challenging drilling and poor copper adhesion—and extremely high costs.
Against this backdrop, high-frequency, high-speed hydrocarbon resin—thanks to its unique molecular structure—has emerged as the perfect solution for balancing performance, processability, and cost. It fills the market gap between conventional epoxy resins and the expensive PTFE, making it the fastest-growing material category in the high-frequency copper-clad laminate (CCL) sector.
II. Technical Breakdown: The Core Advantages of Disai New Materials’ High-Frequency, High-Speed Hydrocarbon Resin
For many years, Disai New Materials has been deeply engaged in the field of electronic chemicals. In response to the stringent requirements for high-frequency signal transmission, we have developed a high-performance hydrocarbon resin formulation with independent intellectual property rights. Compared to conventional products available on the market, Disai New Materials’ solution has achieved optimization in the following key indicators:
1. Extremely low dielectric loss (Low Df): The nonpolar molecular structure of high-frequency, high-speed hydrocarbon resin ensures that its Df value remains at an extremely low level—between 0.002 and 0.003—even at frequencies of 10 GHz and above. This means that in millimeter-wave radar applications, the transmission and reception losses of radar waves are reduced, thereby enhancing detection range and signal-to-noise ratio.
2. Stable Dk: The stability of the Dk value is crucial under different temperature and humidity conditions. Through a special crosslinking modification technology, Disai New Materials has endowed hydrocarbon resins with exceptional thermal stability, ensuring that the radar maintains precise impedance matching even in extreme heat or cold, and preventing frequency drift.

3. Excellent resistance to damp heat and low water absorption: Water molecules are “killers” of high-frequency signals. Due to the hydrophobic nature of carbon-hydrogen bonds, high-frequency, high-speed carbon-hydrogen resins exhibit extremely low water absorption rates (typically below 0.05%). In the complex outdoor operating environment of automobiles, this property ensures the long-term reliability of the circuit board’s electrical performance.
4. Good machinability: Unlike PTFE, Desai New Materials’ hydrocarbon resin system is compatible with existing PCB manufacturing processes, eliminating the need to replace specialized drilling or laminating equipment. This significantly lowers the processing barriers and manufacturing costs for downstream board manufacturers.
III. Application Practice and the Domestic Substitution Process
Currently, Disai New Materials’ high-frequency, high-speed hydrocarbon resin has been successfully applied in numerous high-end electronic manufacturing scenarios, with the most representative examples being 77 GHz millimeter-wave radar and 5G base station power amplifiers (PAs). In the process of domestic substitution, stability is the customers’ biggest concern. By establishing a rigorous batch management system and a comprehensive quality-control framework covering the entire production process, Disai New Materials ensures that fluctuations in each batch’s key parameters remain within extremely narrow ranges. Measured data show that copper-clad laminates fabricated using Disai New Materials’ solutions have achieved performance metrics—such as peel strength, solderability (288℃ soldering test), and coefficient of thermal expansion (CTE)—that are on par with those of leading international brands. Moreover, the application of low-dielectric hydrocarbon resins is gradually expanding to high-speed backplanes for AI servers and terminals for low-Earth-orbit satellite communications.
IV. Frequently Asked Questions (Q&A)
Q1: What’s the difference between high-frequency, high-speed hydrocarbon resin and PPO/PPE resin?
A: Both are excellent high-frequency materials. Hydrocarbon resins typically offer better moisture resistance and rigidity, and they provide greater advantages in cost control; whereas modified PPO is often used in high-layer-count data communication boards. Dicai New Materials’ hydrocarbon-based system, through modification, combines the advantages of multiple materials, delivering outstanding value for money.
Q2: Can Disai New Materials provide customized resin formulations?
A: Yes. We are well aware that different downstream customers—such as CCL manufacturers—have varying process habits. Disai New Materials offers customized services ranging from resin bases to curing systems, helping customers adjust process parameters such as viscosity and gelation time.
Today, driven by both “New Infrastructure” and the intelligentization of automobiles, the self-reliance of materials technology is the cornerstone of supply-chain security. As a critical medium connecting the microscopic world of electronics with the macroscopic world, high-frequency, high-speed hydrocarbon resins possess strategic value that goes without saying. Disai New Materials will continue to dedicate itself to the R&D and iterative improvement of high-performance hydrocarbon resins, providing even higher-quality products to help China’s electronic circuit industry break through technological barriers and achieve genuine, high-quality domestic substitution.

Disai New Materials is a pioneer and practitioner in the development and application of new materials and technologies in the high-end electronic circuit substrate field. Our main products include hydrocarbon resins, high-frequency and high-speed hydrocarbon resins, and low-dielectric hydrocarbon resins. Please feel free to call us for inquiries at 027-81801908 or 13971395740 (same number on WeChat). We’ll provide you with customized, professional services!